Ansys Icepak
Cooling Simulation Software for Electronic Components
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PRODUCT OVERVIEW

Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies/enclosures and power electronics.

Product Features

Ansys Icepak Predict airflow, temperature and heat transfer Elite Channel Partner 3D Engineering Automation LLP

Predict airflow, temperature and heat transfer

With CAD-centric (mechanical and electrical CAD) and multiphysics user interfaces, Icepak facilitates the solving of today’s most challenging thermal management.

Ansys Icepak Electrothermal Analysis of a PCB Elite Channel Partner 3D Engineering Automation LLP

Electrothermal Analysis of a PCB

Power dissipation of ICs and power losses across the board are key inputs for thermal analysis.

Ansys Icepak Electronics Cooling Elite Channel Partner 3D Engineering Automation LLP

Electronics Cooling

You can also conduct thermomechanical stress analysis and airflow analysis to select the ideal heat sink or fan solution. Our integrated workflow enables you to conduct design trade-offs.

Ansys Icepak Thermal Reliability Elite Channel Partner 3D Engineering Automation LLP

Thermal Reliability

Icepak users can easily assemble automated workflows within the Ansys ecosystem to complete multiphysics analyses for electromigration, dielectric breakdown and multi-axial solder joint fatigue.

MODULES

Electronics Cooling & PCB Thermal Simulation and Analysis

Ansys Icepak provides powerful electronic cooling solutions that utilize the industry leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI).

Key Features

Icepak includes all modes of heat transfer — conduction, convection and radiation — for steadystate and transient electronics cooling applications.

Electronics Desktop 3D layout GUI
DC joule heating analysis
Multiple-fluid analysis
Reduced order flow and thermal
Thermo-electric cooler modeling
Package characterization
Integrated graphical modeling environment

Quick Specs

MCAD and ECAD Support

Solar radiation

Parametrics and Optimization

Customization and Automation

Network Modeling

DC Joule Heating Analysis

Electro-thermal and Thermo-Mechanical

Extensive Libraries for Thermal

Liquid Cooling

Varying Flow and Power ROM

Applications

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PCBs, ICs and IC packages

Ansys’ complete PCB design solution enables you to simulates PCBs, ICs, and packages and accurately evaluate an entire system.

Ansys Icepak PCBs, ICs and IC packages Elite Channel Partner 3D Engineering Automation LLP

Electronics Reliability

Learn how Ansys integrated electronics reliability tools can help you solve your biggest thermal, electrical and mechanical reliability challenges.

Ansys Icepak Batteries Elite Channel Partner 3D Engineering Automation LLP

Batteries

Ansys battery modeling and simulation solutions use multiphysics to help you maximize battery performance and safety while reducing cost and testing time.

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Electric Motors

Ansys electric motor design software progresses from concept design to detailed electromagnetics, thermal and mechanical analysis of electric motors.

Case Study

Next-Generation Microsatellites